Creating AlN substrates that will enable next-generation devices


Advantages of our substrate materials:

  • High production rate
  • Scalable
  • Low defectivity (templates <10^7^, bulk <10^4^ defects/cm^2^)
  • High UV transparency

Advantages of our coatings materials:

  • High density
  • Ability to coat directly on copper, aluminum, silicon substrates
  • Thermal conductivity substantially higher than ceramic aluminum nitride
  • High voltage breakdown values

Latest News

    Next Event

    Applied Power Electronics Conference and Expo

    March 16, 2015 – March 19, 2015

    APEC 2015 continues the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineer.

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